The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-030-3141, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND COMPLEMENTARY OUTPUTS AND W/CLEAR AND ASYNCHRONOUS AND SYNCHRONOUS AND RESETTABLE AND POSITIVE OUTPUTS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| end_item_identification | AUDIO-SWITCH-MTX FSCM 30332 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-030-3141 |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| END ITEM IDENTIFICATION | AUDIO-SWITCH-MTX FSCM 30332 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND COMPLEMENTARY OUTPUTS AND W/CLEAR AND ASYNCHRONOUS AND SYNCHRONOUS AND RESETTABLE AND POSITIVE OUTPUTS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |