SC6951FH — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, special_features: FORMED LEADS; RELIABILITY SCREENING REQUIRED, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-00-349-8829, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SC6951FH

NSN: 5962-00-349-8829
FSC: 5962
CAGE: 5V1P1 — ON SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
special_features	FORMED LEADS; RELIABILITY SCREENING REQUIRED
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	DUAL 4 INPUT
inclosure_configuration	FLAT PACK
design_function_and_quantity	2 GATE, NAND-OR BUFFER
NSN	5962-00-349-8829

COMPONENT DIAGRAM

KEY FEATURES

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE

•

DESIGN FUNCTION AND QUANTITY: 2 GATE, NAND-OR BUFFER

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

INCLOSURE CONFIGURATION: FLAT PACK

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

TECHNICAL CHARACTERISTICS

FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE
DESIGN FUNCTION AND QUANTITY	2 GATE, NAND-OR BUFFER
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURES	FORMED LEADS; RELIABILITY SCREENING REQUIRED
INCLOSURE CONFIGURATION	FLAT PACK
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
INCLOSURE MATERIAL	CERAMIC
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

MC932FInterchangeableGOVERNMENT REGISTRY