The MICROCIRCUIT,DIGITAL-LINEAR is a the manufacturer industrial component. Key specifications include features_provided: BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: SILICON, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, input_circuit_pattern: 3 STAGE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-206-2292, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | BURN IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 3 STAGE |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 PRINTED CIRCUIT |
| design_function_and_quantity | 1 BUFFER, NONINVERTING |
| NSN | 5962-01-206-2292 |
| FEATURES PROVIDED | BURN IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, NONINVERTING |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | 3 STAGE |
| TERMINAL SURFACE TREATMENT | SOLDER |