SC2794F — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

SC2794F: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND RELIABILITY SCREENING REQUIRED AND BURN IN AND POSITIVE OUTPUTS, output_logic_form: DIODE-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-245-5318, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SC2794F

NSN: 5962-00-245-5318
FSC: 5962 — Microcircuits, Electronic
CAGE: 04713 — FREESCALE SEMICONDUCTOR, INC. (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND RELIABILITY SCREENING REQUIRED AND BURN IN AND POSITIVE OUTPUTS
output_logic_form	DIODE-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	9 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	14 FLAT LEADS
NSN	5962-00-245-5318

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 9 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 TRANSLATOR, LEVEL

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND RELIABILITY SCREENING REQUIRED AND BURN IN AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	9 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 TRANSLATOR, LEVEL
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND RELIABILITY SCREENING REQUIRED AND BURN IN AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

MC1218FReference document

Same NSN cross-reference

Reference document — Secondary reference

2794-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is SC2794F?

SC2794F is a MICROCIRCUIT,DIGITAL.

What parts can replace SC2794F?

There are 2 known substitutes for SC2794F: MC1218F, 2794-1. Substitute compatibility should be verified for your specific system.

What is the NSN for SC2794F?

SC2794F is cataloged in the U.S. Government catalog under NSN 5962-00-245-5318. This indicates validated use in U.S. government and defense supply chains.

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SC2794F — MICROCIRCUIT,DIGITAL

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