The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.375 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.250 INCHES MINIMUM IN, overall_diameter: 0.200 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-484-8041, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.375 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.250 INCHES MINIMUM IN |
| overall_diameter | 0.200 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 80131-RELEASE5729 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| current_rating_per_characteristic | 3.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 400.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 170.0 CELSIUS CASE DEGC |
| NSN | 5961-00-484-8041 |
| MATERIAL | GLASS ENCLOSURE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 170.0 CELSIUS CASE DEGC |
| MOUNTING METHOD | TERMINAL |
| SPECIFICATION/STANDARD DATA | 80131-RELEASE5729 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| OVERALL LENGTH | 0.375 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.250 INCHES MINIMUM IN |
| MATERIAL | SILICON SEMICONDUCTOR |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 400.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| OVERALL DIAMETER | 0.200 INCHES MAXIMUM IN |