The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.685 INCHES MINIMUM AND 0.850 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: PLASTIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-105-5889, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 0.685 INCHES MINIMUM AND 0.850 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 6 BUFFER, INVERTING AND 6 DRIVER, INVERTING |
| NSN | 5962-01-105-5889 |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| BODY LENGTH | 0.685 INCHES MINIMUM AND 0.850 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING AND 6 DRIVER, INVERTING |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | PLASTIC |