SARCON GR-PM: PUTTY,THERMAL,CONDU.
The PUTTY,THERMAL,CONDU is a the manufacturer industrial component. Key specifications include material: SILICONE, overall_width: 200.000 MILLIMETERS NOMINAL MM, overall_height: 2.000 MILLIMETERS NOMINAL MM, overall_length: 300.000 MILLIMETERS NOMINAL MM, end_item_identification: F/A-18 E/F, part_name_assigned_by_controlling_agency: SILICONE PUTTY SHEET. This part is cataloged in the U.S.
Government catalog under NSN 6850-01-600-4196, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| overall_width | 200.000 MILLIMETERS NOMINAL MM |
| overall_height | 2.000 MILLIMETERS NOMINAL MM |
| overall_length | 300.000 MILLIMETERS NOMINAL MM |
| special_features | HIGHLY THERMAL CONDUCTIVE & NON-FLAMMABLE SILICONE PUTTY SHEETS; USE BETWEEN CHASSIS WALL/OTHER SURFACE, CPU AND HEAT SINK, SEMICONDUCTOR AND HEAT SINK, SHAPE: RECTANGULAR |
| end_item_identification | F/A-18 E/F |
| part_name_assigned_by_controlling_agency | SILICONE PUTTY SHEET |
| NSN | 6850-01-600-4196 |
| OVERALL HEIGHT | 2.000 MILLIMETERS NOMINAL MM |
| OVERALL LENGTH | 300.000 MILLIMETERS NOMINAL MM |
| OVERALL WIDTH | 200.000 MILLIMETERS NOMINAL MM |
| SPECIAL FEATURES | HIGHLY THERMAL CONDUCTIVE & NON-FLAMMABLE SILICONE PUTTY SHEETS; USE BETWEEN CHASSIS WALL/OTHER SURFACE, CPU AND HEAT SINK, SEMICONDUCTOR AND HEAT SINK, SHAPE: RECTANGULAR |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | SILICONE PUTTY SHEET |
| END ITEM IDENTIFICATION | F/A-18 E/F |
| MATERIAL | SILICONE |
No substitute or cross-reference records for this part.