The SEALING COMPOUND is a the manufacturer industrial component. Key specifications include color: BLACK, material: PLASTIC EPOXY, curing_method: HEAT, specific_usage_design: FOR ELECTRICAL ENCAPSULATING AND SEALING APPLICATIONS, supplementary_features: 1000 RINGS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 8030-01-569-2597, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| color | BLACK |
| material | PLASTIC EPOXY |
| curing_method | HEAT |
| special_features | PRE-FORMED RING; 0.041 IN. RING INNER DIAMETER, 0.071 IN. RING OUTER DIAMETER, 0.045 IN. RING THICKNESS; 10 JAR MINIMUM ORDER IN |
| specific_usage_design | FOR ELECTRICAL ENCAPSULATING AND SEALING APPLICATIONS |
| supplementary_features | 1000 RINGS |
| NSN | 8030-01-569-2597 |
| COLOR | BLACK |
| MATERIAL | PLASTIC EPOXY |
| SUPPLEMENTARY FEATURES | 1000 RINGS |
| SPECIFIC USAGE DESIGN | FOR ELECTRICAL ENCAPSULATING AND SEALING APPLICATIONS |
| SPECIAL FEATURES | PRE-FORMED RING; 0.041 IN. RING INNER DIAMETER, 0.071 IN. RING OUTER DIAMETER, 0.045 IN. RING THICKNESS; 10 JAR MINIMUM ORDER IN |
| CURING METHOD | HEAT |