The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: ALUMINUM ALLOY 2024, overall_width: 0.3112 INCHES NOMINAL IN, overall_length: 3.070 INCHES NOMINAL IN, inside_diameter: 0.187 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 6130-01-668-3287, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY 2024 |
| overall_width | 0.3112 INCHES NOMINAL IN |
| overall_length | 3.070 INCHES NOMINAL IN |
| inside_diameter | 0.187 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| outside_diameter | 0.312 INCHES NOMINAL IN |
| overall_diameter | 0.090 INCHES MAXIMUM IN |
| special_features | TWO HOLES 4-40 UNC-2B; ONE HOLE 0.160 DIA X 0.090 DP; ONE HOLE 0.032 DIA X 0.120 DP; BOTH ENDS BREAK SHARP EDGES 0.005 MAX |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 5.25 MILLIAMPERES MAXIMUM PEAK POINT CURRENT |
| NSN | 6130-01-668-3287 |