S82S191/883B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 1.220 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-072-3631, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.120 INCHES MAXIMUM IN |
| body_length | 1.220 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| end_item_identification | AN/ALQ-155V V |
| NSN | 5962-01-072-3631 |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | PROGRAMMED |
| BODY LENGTH | 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| END ITEM IDENTIFICATION | AN/ALQ-155V V |
| MAXIMUM POWER DISSIPATION RATING | 1017.0 MILLIWATTS |