Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: S82S137F

S82S137F ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.306 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.915 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, memory_capacity: UNKNOWN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-078-0181, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

S82S137F

NSN: 5962-01-078-0181
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.306 INCHES MAXIMUM IN
body_height	0.175 INCHES MAXIMUM IN
body_length	0.915 INCHES MAXIMUM IN
bit_quantity	4096
word_quantity	1024
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	82577-932883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-078-0181

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 532.5 MILLIWATTS

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

MEMORY CAPACITY: UNKNOWN

•

TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TEST DATA DOCUMENT: 82577-932883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MAXIMUM POWER DISSIPATION RATING	532.5 MILLIWATTS
BODY WIDTH	0.310 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
TIME RATING PER CHACTERISTIC	80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY CAPACITY	UNKNOWN
TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	82577-932883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

17985Interchangeable