S82S129AF883B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

S82S129AF883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 256, features_provided: PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-232-9984, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

S82S129AF883B

NSN: 5962-01-232-9984
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.302 INCHES MAXIMUM IN
body_height	0.175 INCHES MAXIMUM IN
body_length	0.785 INCHES MAXIMUM IN
bit_quantity	1024
word_quantity	256
features_provided	PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-232-9984

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 1024

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

WORD QUANTITY: 256

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.302 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	1024
INPUT CIRCUIT PATTERN	10 INPUT
WORD QUANTITY	256
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.302 INCHES MAXIMUM IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 3

82S129A/BEAReference document

Same NSN cross-reference

Reference document — Design control — primary reference

BM0477-700Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is S82S129AF883B?

S82S129AF883B is a MICROCIRCUIT,MEMORY.

What parts can replace S82S129AF883B?

There are 3 known substitutes for S82S129AF883B: 82S129A/BEA, BM0477-700, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for S82S129AF883B?

S82S129AF883B is cataloged in the U.S. Government catalog under NSN 5962-01-232-9984. This indicates validated use in U.S. government and defense supply chains.

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