S82LS181F/883 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

S82LS181F/883: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.620 INCHES MAXIMUM IN, body_height: 0.130 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-218-9268, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

S82LS181F/883

NSN: 5962-01-218-9268
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.620 INCHES MAXIMUM IN
body_height	0.130 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
special_features	ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE ELECTRONICS SUPPLY CENTER PRODUCTION STANDARD NO. L04394; FOR NAVY NUCLEAR PROPULSION PLANT PRODUCTS ONLY
features_provided	HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 CHANNEL
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-218-9268

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 CHANNEL

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.130 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 CHANNEL
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.130 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	85.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM

SUBSTITUTES & CROSS-REFERENCES 3

KRD1918BReference document

Same NSN cross-reference

Reference document — Design control — primary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

JBP28L86AMJReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is S82LS181F/883?

S82LS181F/883 is a MICROCIRCUIT,MEMORY.

What parts can replace S82LS181F/883?

There are 3 known substitutes for S82LS181F/883: KRD1918B, ROM/PROM, JBP28L86AMJ. Substitute compatibility should be verified for your specific system.

What is the NSN for S82LS181F/883?

S82LS181F/883 is cataloged in the U.S. Government catalog under NSN 5962-01-218-9268. This indicates validated use in U.S. government and defense supply chains.

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