S8233W883B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

S8233W883B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-532-1007, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

S8233W883B

NSN: 5962-00-532-1007
NIINs: 005321007, 010148089
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height	0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-00-532-1007

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MULTIPLEXER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND TRUE/COMPLEMENTARY

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MULTIPLEXER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
BODY HEIGHT	0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND TRUE/COMPLEMENTARY
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.340 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

CC130RReference document

Same NSN cross-reference

Reference document — Secondary reference

UEF3520Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

RC8233R17Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is S8233W883B?

S8233W883B is a MICROCIRCUIT,DIGITAL.

What parts can replace S8233W883B?

There are 3 known substitutes for S8233W883B: CC130R, UEF3520, RC8233R17. Substitute compatibility should be verified for your specific system.

What is the NSN for S8233W883B?

S8233W883B is cataloged in the U.S. Government catalog under NSN 5962-00-532-1007. This indicates validated use in U.S. government and defense supply chains.

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