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S57-8045 — SEMICONDUCTOR DEVICE,THYRISTOR

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

S57-8045: SEMICONDUCTOR DEVICE,THYRISTOR.

The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.420 INCHES MAXIMUM IN, overall_height: 0.190 INCHES MAXIMUM IN, overall_length: 0.325 INCHES MINIMUM AND 0.355 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), special_features: JUNCTION PATTERN ARRANGEMENT: PNPN. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-197-3418, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
S57-8045
NSN: 5961-00-197-3418
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 54418 — MILTOPE CORPORATION (USA)
SPECIFICATIONS
materialPLASTIC ENCLOSURE
overall_width0.420 INCHES MAXIMUM IN
overall_height0.190 INCHES MAXIMUM IN
overall_length0.325 INCHES MINIMUM AND 0.355 INCHES MAXIMUM IN
mounting_methodUNTHREADED HOLE(S)
special_featuresJUNCTION PATTERN ARRANGEMENT: PNPN
features_providedHERMETICALLY SEALED CASE
internal_configurationJUNCTION CONTACT
semiconductor_materialSILICON
mounting_facility_quantity1
terminal_type_and_quantity3 UNINSULATED WIRE LEAD
current_rating_per_characteristic10.00 AMPERES MAXIMUM FORWARD CURRENT, DC
NSN5961-00-197-3418
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN S57-8045 MFR OEM SEMICONDUCTOR DEVICE,THYRISTOR
KEY FEATURES
•
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 200.0 MAXIMUM BREAKOVER VOLTAGE, DC
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 100.0 CELSIUS JUNCTION DEGC
•
MOUNTING FACILITY QUANTITY: 1
•
MOUNTING METHOD: UNTHREADED HOLE(S)
•
SEMICONDUCTOR MATERIAL: SILICON
•
INTERNAL CONFIGURATION: JUNCTION CONTACT
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.190 INCHES MAXIMUM IN
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC200.0 MAXIMUM BREAKOVER VOLTAGE, DC
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT100.0 CELSIUS JUNCTION DEGC
MOUNTING FACILITY QUANTITY1
MOUNTING METHODUNTHREADED HOLE(S)
SEMICONDUCTOR MATERIALSILICON
OVERALL LENGTH0.325 INCHES MINIMUM AND 0.355 INCHES MAXIMUM IN
INTERNAL CONFIGURATIONJUNCTION CONTACT
OVERALL WIDTH0.420 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED CASE
SUBSTITUTES & CROSS-REFERENCES 3
107X00097Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
SC146BReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
1510765Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is S57-8045?
S57-8045 is a SEMICONDUCTOR DEVICE,THYRISTOR.
What parts can replace S57-8045?
There are 3 known substitutes for S57-8045: 107X00097, SC146B, 1510765. Substitute compatibility should be verified for your specific system.
What is the NSN for S57-8045?
S57-8045 is cataloged in the U.S. Government catalog under NSN 5961-00-197-3418. This indicates validated use in U.S. government and defense supply chains.
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