S54S04W: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-076-4684, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MAXIMUM IN |
| body_height | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| body_length | 0.350 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| end_item_identification | GUIDANCE UNIT,MIDCOURSE,TYPE CP-1137/DSQ-28 |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-076-4684 |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 6 INVERTER, DIGITAL |
| BODY WIDTH | 0.265 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.350 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |