The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.730 INCHES NOMINAL IN, body_height: 0.056 INCHES NOMINAL IN, body_length: 0.340 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED, inclosure_material: SILICON, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-406-2305, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.730 INCHES NOMINAL IN |
| body_height | 0.056 INCHES NOMINAL IN |
| body_length | 0.340 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED |
| inclosure_material | SILICON |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 2 FLIP-FLOP, J-K |
| NSN | 5962-00-406-2305 |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.340 INCHES NOMINAL IN |
| BODY HEIGHT | 0.056 INCHES NOMINAL IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.730 INCHES NOMINAL IN |
| INCLOSURE MATERIAL | SILICON |