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S25FL256SAGMFI001 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

S25FL256SAGMFI001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include overall_width: 10.3 MILLIMETERS NOMINAL MM, overall_height: 2.35 MILLIMETERS MINIMUM AND 2.65 MILLIMETERS MAXIMUM MM, overall_length: 10.3 MILLIMETERS NOMINAL MM, special_features: PACKAGING MATERIAL: HALOGEN-FREE, LEAD (PB)-FREE; PACKAGING TYPE: TUBE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-703-3274, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
S25FL256SAGMFI001
NSN: 5962-01-703-3274
FSC: 5962 — Microcircuits, Electronic
CAGE: 65786 — INFINEON TECHNOLOGIES AMERICAS CORP. (USA)
SPECIFICATIONS
overall_width10.3 MILLIMETERS NOMINAL MM
overall_height2.35 MILLIMETERS MINIMUM AND 2.65 MILLIMETERS MAXIMUM MM
overall_length10.3 MILLIMETERS NOMINAL MM
special_featuresPACKAGING MATERIAL: HALOGEN-FREE, LEAD (PB)-FREE; PACKAGING TYPE: TUBE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
terminal_type_and_quantity16 PIN
part_name_assigned_by_controlling_agencyFLASH MEMORY
NSN5962-01-703-3274
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN S25FL256SAGMFI001 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 16 PIN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT2.35 MILLIMETERS MINIMUM AND 2.65 MILLIMETERS MAXIMUM MM
OVERALL LENGTH10.3 MILLIMETERS NOMINAL MM
OVERALL WIDTH10.3 MILLIMETERS NOMINAL MM
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURESPACKAGING MATERIAL: HALOGEN-FREE, LEAD (PB)-FREE; PACKAGING TYPE: TUBE
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYFLASH MEMORY
TERMINAL TYPE AND QUANTITY16 PIN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is S25FL256SAGMFI001?
S25FL256SAGMFI001 is a MICROCIRCUIT,MEMORY.
What is the NSN for S25FL256SAGMFI001?
S25FL256SAGMFI001 is cataloged in the U.S. Government catalog under NSN 5962-01-703-3274. This indicates validated use in U.S. government and defense supply chains.
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