S1020227: MICROCIRCUIT ASSEMBLY.
The MICROCIRCUIT ASSEMBLY is a the manufacturer industrial component. Key specifications include body_width: 40.0 MILLIMETERS NOMINAL MM, body_height: 20.0 MILLIMETERS NOMINAL MM, special_features: THICKNESS: 19.8MM MM, end_item_identification: 2350-01-458-7410, part_name_assigned_by_controlling_agency: EM MODULE ASSEMBLY. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-701-9242, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 40.0 MILLIMETERS NOMINAL MM |
| body_height | 20.0 MILLIMETERS NOMINAL MM |
| special_features | THICKNESS: 19.8MM MM |
| end_item_identification | 2350-01-458-7410 |
| part_name_assigned_by_controlling_agency | EM MODULE ASSEMBLY |
| NSN | 5962-01-701-9242 |
| BODY WIDTH | 40.0 MILLIMETERS NOMINAL MM |
| BODY HEIGHT | 20.0 MILLIMETERS NOMINAL MM |
| SPECIAL FEATURES | THICKNESS: 19.8MM MM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | EM MODULE ASSEMBLY |
| END ITEM IDENTIFICATION | 2350-01-458-7410 |
No substitute or cross-reference records for this part.