RX3381: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.195 INCHES NOMINAL IN, body_height: 0.070 INCHES NOMINAL IN, body_length: 0.270 INCHES NOMINAL IN, special_features: RELIABILITY SCREENING REQUIRED, features_provided: HERMETICALLY SEALED AND EXPANDABLE, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-248-9563, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.195 INCHES NOMINAL IN |
| body_height | 0.070 INCHES NOMINAL IN |
| body_length | 0.270 INCHES NOMINAL IN |
| special_features | RELIABILITY SCREENING REQUIRED |
| features_provided | HERMETICALLY SEALED AND EXPANDABLE |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 8 INPUT |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 1 GATE, NAND-NOR |
| NSN | 5962-00-248-9563 |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, NAND-NOR |
| BODY WIDTH | 0.195 INCHES NOMINAL IN |
| BODY HEIGHT | 0.070 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND EXPANDABLE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.270 INCHES NOMINAL IN |
| SPECIAL FEATURES | RELIABILITY SCREENING REQUIRED |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |