RTV577/DBT: SEALING COMPOUND.
The SEALING COMPOUND is a the manufacturer industrial component. Key specifications include material: SILICONE, physical_form: PASTE, special_features: FOR LOW TEMPERATURE APPLICATIONS; SERVICE TEMPERATURE RANGE OF MINUS 175 DEG F TO PLUS 400 DEG F DEGF, features_provided: SEPARATE CATALYST, specific_usage_design: FOR POTTING AND ENCAPSULATING ELECTRICAL AND ELECTRONIC EQUIPMENT, supplementary_features: 1 POUND KIT LBS. This part is cataloged in the U.S.
Government catalog under NSN 8030-00-165-6550, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| physical_form | PASTE |
| special_features | FOR LOW TEMPERATURE APPLICATIONS; SERVICE TEMPERATURE RANGE OF MINUS 175 DEG F TO PLUS 400 DEG F DEGF |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR POTTING AND ENCAPSULATING ELECTRICAL AND ELECTRONIC EQUIPMENT |
| supplementary_features | 1 POUND KIT LBS |
| quantity_within_each_unit_package | 1.000 POUNDS LBS |
| NSN | 8030-00-165-6550 |
| SUPPLEMENTARY FEATURES | 1 POUND KIT LBS |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 1.000 POUNDS LBS |
| PHYSICAL FORM | PASTE |
| COLOR | WHITE |
| SPECIAL FEATURES | FOR LOW TEMPERATURE APPLICATIONS; SERVICE TEMPERATURE RANGE OF MINUS 175 DEG F TO PLUS 400 DEG F DEGF |
| SPECIFIC USAGE DESIGN | FOR POTTING AND ENCAPSULATING ELECTRICAL AND ELECTRONIC EQUIPMENT |
| MATERIAL | SILICONE |