ROM/RPOM: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.200 INCHES MAXIMUM IN, body_height: 0.310 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-372-6878, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.200 INCHES MAXIMUM IN |
| body_height | 0.310 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | PROGRAMMABLE |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| hybrid_technology_type | MONOLITHIC |
| end_item_identification | 7P BLK 2 DCN,E/I FSCM 49956 |
| NSN | 5962-01-372-6878 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.200 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.310 INCHES MAXIMUM IN |
| FEATURES PROVIDED | PROGRAMMABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES MAXIMUM OUTPUT |
| MEMORY DEVICE TYPE | PAL |