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Technical Data Sheet

ROM/PROM HEAD 291 — Technical Data Sheet

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· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_capacity: 32, inclosure_material: SILICON, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, hybrid_technology_type: MONOLITHIC, inclosure_configuration: SINGLE-IN-LINE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-645-5281, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 291
NSN: 5962-01-645-5281
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
memory_capacity32
inclosure_materialSILICON
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_typeMONOLITHIC
inclosure_configurationSINGLE-IN-LINE
terminal_type_and_quantity15 CASE
maximum_power_dissipation_rating1.04 WATTS
part_name_assigned_by_controlling_agencyMICROCIRCUIT,MEMORY,DIGITAL
voltage_rating_and_type_per_characteristic5.5 VOLTS NOMINAL ABSOLUTE INPUT
NSN5962-01-645-5281
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 291 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
MEMORY CAPACITY: 32
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
INCLOSURE MATERIAL: SILICON
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATION: SINGLE-IN-LINE
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL ABSOLUTE INPUT
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY CAPACITY32
PART NAME ASSIGNED BY CONTROLLING AGENCYMICROCIRCUIT,MEMORY,DIGITAL
MAXIMUM POWER DISSIPATION RATING1.04 WATTS
INCLOSURE MATERIALSILICON
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONSINGLE-IN-LINE
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS NOMINAL ABSOLUTE INPUT
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY15 CASE
HYBRID TECHNOLOGY TYPEMONOLITHIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
B18.2.1Interchangeable
interchangeable cross-reference
interchangeable
MS35355-67Interchangeable
interchangeable cross-reference
interchangeable
426927Interchangeable
interchangeable cross-reference
interchangeable
82008Interchangeable
interchangeable cross-reference
interchangeable
2140130Interchangeable
interchangeable cross-reference
interchangeable
667770Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 291?
ROM/PROM HEAD 291 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 291?
There are 22 known substitutes for ROM/PROM HEAD 291: B18.2.1, MS35355-67, 426927 and 19 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 291?
ROM/PROM HEAD 291 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-645-5281. This indicates validated use in U.S. government and defense supply chains.
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