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Technical Data Sheet

ROM/PROM HEAD 275 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ROM/PROM HEAD 275: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE, memory_device_type: EPROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-392-7451, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 275
NSN: 5962-01-392-7451
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
features_providedELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE
memory_device_typeEPROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
NSN5962-01-392-7451
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 275 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: EPROM
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEEPROM
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
CY7C251-65WMBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-89537Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8953701YASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 275?
ROM/PROM HEAD 275 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 275?
There are 3 known substitutes for ROM/PROM HEAD 275: CY7C251-65WMB, 5962-89537, 5962-8953701YA. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 275?
ROM/PROM HEAD 275 is cataloged in the U.S. Government catalog under NSN 5962-01-392-7451. This indicates validated use in U.S. government and defense supply chains.
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