ROM/PROM HEAD 254 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 254: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-264-3009, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 254

NSN: 5962-01-264-3009
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-264-3009

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES NOMINAL OUTPUT
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 9

PAL16R4AMFKBReference document

Same NSN cross-reference

Reference document — Secondary reference

81036102BReference document

Same NSN cross-reference

Reference document — Secondary reference

10133855Reference document

Same NSN cross-reference

Reference document — Informative reference only

81036102XReference document

Same NSN cross-reference

Reference document — Secondary reference

81036102ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

AMPAL16R4A/B2AReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 254?

ROM/PROM HEAD 254 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 254?

There are 9 known substitutes for ROM/PROM HEAD 254: PAL16R4AMFKB, 81036102B, 10133855 and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 254?

ROM/PROM HEAD 254 is cataloged in the U.S. Government catalog under NSN 5962-01-264-3009. This indicates validated use in U.S. government and defense supply chains.

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