ROM/PROM HEAD 230 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 230: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.460 INCHES MAXIMUM IN, body_height: 0.088 INCHES MAXIMUM IN, body_length: 0.460 INCHES MAXIMUM IN, overall_width: 0.460 INCHES MAXIMUM IN, overall_height: 0.100 INCHES MAXIMUM IN, overall_length: 0.460 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-315-1507, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 230

NSN: 5962-01-315-1507
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.460 INCHES MAXIMUM IN
body_height	0.088 INCHES MAXIMUM IN
body_length	0.460 INCHES MAXIMUM IN
overall_width	0.460 INCHES MAXIMUM IN
overall_height	0.100 INCHES MAXIMUM IN
overall_length	0.460 INCHES MAXIMUM IN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
NSN	5962-01-315-1507

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC

•

BODY WIDTH: 0.460 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.088 INCHES MAXIMUM IN

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.100 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 ARRAY, LOGIC
BODY WIDTH	0.460 INCHES MAXIMUM IN
BODY HEIGHT	0.088 INCHES MAXIMUM IN
OVERALL LENGTH	0.460 INCHES MAXIMUM IN
OVERALL WIDTH	0.460 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT

SUBSTITUTES & CROSS-REFERENCES 5

S82S100G/B3CReference document

Same NSN cross-reference

Reference document — Secondary reference

S82S100/B3AReference document

Same NSN cross-reference

Reference document — Secondary reference

82S100/B3XReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

G104678-853Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

82S100/B3AReference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 230?

ROM/PROM HEAD 230 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 230?

There are 5 known substitutes for ROM/PROM HEAD 230: S82S100G/B3C, S82S100/B3A, 82S100/B3X and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 230?

ROM/PROM HEAD 230 is cataloged in the U.S. Government catalog under NSN 5962-01-315-1507. This indicates validated use in U.S. government and defense supply chains.

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