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PartsTable / COMPONENT / ROM/PROM HEAD 228
ROM/PROM HEAD 228 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The ROM/PROM HEAD 228 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-298-2294, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 228
NSN: 5962-01-298-2294
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
Part NumberROM/PROM HEAD 228
NSN5962-01-298-2294
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available ROM/PROM HEAD 228 TITLE COMPONENT PN ROM/PROM HEAD 228 MFR ROM/PROM HEAD 228
KEY FEATURES
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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
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MEMORY DEVICE TYPE: PAL
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CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT SINK
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INCLOSURE CONFIGURATION: DUAL-IN-LINE
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BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
TECHNICAL CHARACTERISTICS (FLIS)
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPEPAL
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES NOMINAL OUTPUT SINK
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY WIDTH0.310 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
TERMINAL SURFACE TREATMENTSOLDER
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
VERIFIED SUBSTITUTES & CROSS-REFERENCES 34
761-1-R4.7KInterchangeable
interchangeable cross-reference
interchangeable
898-1-R4.7KInterchangeable
interchangeable cross-reference
interchangeable
4116R002-472SInterchangeable
interchangeable cross-reference
interchangeable
5962-8412904BLBInterchangeable
interchangeable cross-reference
interchangeable
8412904LXInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 066Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 228?
ROM/PROM HEAD 228 is a ROM/PROM HEAD 228.
What parts can replace ROM/PROM HEAD 228?
There are 34 known substitutes for ROM/PROM HEAD 228: 761-1-R4.7K, 898-1-R4.7K, 4116R002-472S and 31 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 228?
ROM/PROM HEAD 228 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-298-2294. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026