ROM/PROM HEAD 226 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 226: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.420 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: METAL OR CERAMIC OR PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-261-4049, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 226

NSN: 5962-01-261-4049
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.420 INCHES MAXIMUM IN
body_height	0.090 INCHES MAXIMUM IN
body_length	0.640 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	METAL OR CERAMIC OR PLASTIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-261-4049

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: METAL OR CERAMIC OR PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.420 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.090 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	METAL OR CERAMIC OR PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.420 INCHES MAXIMUM IN
BODY HEIGHT	0.090 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	FLAT PACK
CURRENT RATING PER CHARACTERISTIC	185.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	F-6 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 5

5962-8552704KBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8552704KAReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85527Reference document

Same NSN cross-reference

Reference document — Identification reference

AM27S47A/BKAReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8552704KXReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 226?

ROM/PROM HEAD 226 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 226?

There are 5 known substitutes for ROM/PROM HEAD 226: 5962-8552704KB, 5962-8552704KA, 5962-85527 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 226?

ROM/PROM HEAD 226 is cataloged in the U.S. Government catalog under NSN 5962-01-261-4049. This indicates validated use in U.S. government and defense supply chains.

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