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Technical Data Sheet

ROM/PROM HEAD 217 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ROM/PROM HEAD 217: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-336-3383, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 217
NSN: 5962-01-336-3383
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-336-3383
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 217 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CURRENT RATING PER CHARACTERISTIC: 70.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC70.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 8
91681327Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
77089806Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
PALC16R4-20DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8871312RXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8871312RBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88713Reference document
Same NSN cross-reference
Reference document — Identification reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 217?
ROM/PROM HEAD 217 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 217?
There are 8 known substitutes for ROM/PROM HEAD 217: 91681327, 77089806, PALC16R4-20DMB and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 217?
ROM/PROM HEAD 217 is cataloged in the U.S. Government catalog under NSN 5962-01-336-3383. This indicates validated use in U.S. government and defense supply chains.
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