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PartsTable / COMPONENT / ROM/PROM HEAD 200
ROM/PROM HEAD 200 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The ROM/PROM HEAD 200 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-331-7106, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 200
NSN: 5962-01-331-7106
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
Part NumberROM/PROM HEAD 200
NSN5962-01-331-7106
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available ROM/PROM HEAD 200 TITLE COMPONENT PN ROM/PROM HEAD 200 MFR ROM/PROM HEAD 200
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND BIDIRECTIONAL
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
MEMORY DEVICE TYPE: PAL
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
•
TERMINAL SURFACE TREATMENT: SOLDER
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
FEATURES PROVIDEDBIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND BIDIRECTIONAL
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
TERMINAL SURFACE TREATMENTSOLDER
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH1.060 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 19
973595-0001Interchangeable
interchangeable cross-reference
interchangeable
5962-8515509RXInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
301032Interchangeable
interchangeable cross-reference
interchangeable
300930Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 200Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 200?
ROM/PROM HEAD 200 is a ROM/PROM HEAD 200.
What parts can replace ROM/PROM HEAD 200?
There are 19 known substitutes for ROM/PROM HEAD 200: 973595-0001, 5962-8515509RX, ROM/PROM and 16 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 200?
ROM/PROM HEAD 200 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-331-7106. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026