The ROM/PROM HEAD 181 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-375-4964, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| Part Number | ROM/PROM HEAD 181 |
| NSN | 5962-01-375-4964 |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| MEMORY DEVICE TYPE | PROM |
| CURRENT RATING PER CHARACTERISTIC | 185.00 MILLIAMPERES MAXIMUM SUPPLY |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TERMINAL SURFACE TREATMENT | SOLDER |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-6 MIL-M-38510 |
| TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
| TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |