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ROM/PROM HEAD 181 — Technical Data Sheet

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— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-375-4964, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 181
NSN: 5962-01-375-4964
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
body_length0.640 INCHES MAXIMUM IN
features_providedPROGRAMMED AND W/ACTIVE PULL-UP AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND SCHOTTKY AND BIPOLAR AND W/ENABLE AND MONOLITHIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-375-4964
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 181 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: FLAT PACK
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
MEMORY DEVICE TYPE: PROM
•
CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TERMINAL SURFACE TREATMENT: SOLDER
•
CASE OUTLINE SOURCE AND DESIGNATOR: F-6 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONFLAT PACK
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
MEMORY DEVICE TYPEPROM
CURRENT RATING PER CHARACTERISTIC185.00 MILLIAMPERES MAXIMUM SUPPLY
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENTSOLDER
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
TIME RATING PER CHACTERISTIC55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 28
6657345-3Interchangeable
interchangeable cross-reference
interchangeable
6657345-7Interchangeable
interchangeable cross-reference
interchangeable
D3636B1Interchangeable
interchangeable cross-reference
interchangeable
M38510/21004BJBInterchangeable
interchangeable cross-reference
interchangeable
M38510/21004BJXInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 120Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 181?
ROM/PROM HEAD 181 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 181?
There are 28 known substitutes for ROM/PROM HEAD 181: 6657345-3, 6657345-7, D3636B1 and 25 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 181?
ROM/PROM HEAD 181 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-375-4964. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: September 2026