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Technical Data Sheet

ROM/PROM HEAD 172 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ROM/PROM HEAD 172: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-336-7012, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 172
NSN: 5962-01-336-7012
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-336-7012
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN ROM/PROM HEAD 172 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC120.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
MEMORY DEVICE TYPEPROM
SUBSTITUTES & CROSS-REFERENCES 5
5962-8863601LXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8863601LASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-88636Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8863601LBReference document
Same NSN cross-reference
Reference document — Secondary reference
CY7C235-40DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 172?
ROM/PROM HEAD 172 is a MICROCIRCUIT,DIGITAL.
What parts can replace ROM/PROM HEAD 172?
There are 5 known substitutes for ROM/PROM HEAD 172: 5962-8863601LX, 5962-8863601LA, 5962-88636 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 172?
ROM/PROM HEAD 172 is cataloged in the U.S. Government catalog under NSN 5962-01-336-7012. This indicates validated use in U.S. government and defense supply chains.
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