ROM/PROM HEAD 159 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 159: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-313-1156, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 159

NSN: 5962-01-313-1156
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	20 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-313-1156

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 20 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	20 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
BODY LENGTH	1.280 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 9

5962-8767101BLBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8767101LASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8767101LBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-87671Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8767101BLXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8767101LXReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 159?

ROM/PROM HEAD 159 is a MICROCIRCUIT,MEMORY.

What parts can replace ROM/PROM HEAD 159?

There are 9 known substitutes for ROM/PROM HEAD 159: 5962-8767101BLB, 5962-8767101LA, 5962-8767101LB and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 159?

ROM/PROM HEAD 159 is cataloged in the U.S. Government catalog under NSN 5962-01-313-1156. This indicates validated use in U.S. government and defense supply chains.

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