ROM/PROM HEAD 153 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 153: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BIDIRECTIONAL AND W/RESET AND 3-STATE OUTPUT AND EXPANDABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-147-7031, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 153

NSN: 5962-01-147-7031
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BIDIRECTIONAL AND W/RESET AND 3-STATE OUTPUT AND EXPANDABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	35 INPUT
end_item_identification	4935-01-120-5489 18876
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-147-7031

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 35 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 PERIPHERAL, INTERFACE

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BIDIRECTIONAL AND W/RESET AND 3-STATE OUTPUT AND EXPANDABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	35 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 PERIPHERAL, INTERFACE
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BIDIRECTIONAL AND W/RESET AND 3-STATE OUTPUT AND EXPANDABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

D8741AReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 153?

ROM/PROM HEAD 153 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 153?

There is 1 known substitute for ROM/PROM HEAD 153: D8741A. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 153?

ROM/PROM HEAD 153 is cataloged in the U.S. Government catalog under NSN 5962-01-147-7031. This indicates validated use in U.S. government and defense supply chains.

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