The ROM/PROM HEAD 150 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-3019, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| Part Number | ROM/PROM HEAD 150 |
| NSN | 5962-01-264-3019 |
| TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/504 GOVERNMENT SPECIFICATION |
| TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY |
| INCLOSURE MATERIAL | CERAMIC |