The ROM/PROM HEAD 110 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-286-1614, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| Part Number | ROM/PROM HEAD 110 |
| NSN | 5962-01-286-1614 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| MEMORY CAPACITY | UNKNOWN |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | ROM |