The ROM/PROM HEAD 101 is a the manufacturer industrial component. This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-257-4584, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| Part Number | ROM/PROM HEAD 101 |
| NSN | 5962-01-257-4584 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | SILICON |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC ARRAY,MONOLITHIC SILICON |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | PROGRAMMED |
| TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM SUPPLY |