The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-163-1771, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN |
| body_height | 0.217 INCHES MAXIMUM IN |
| body_length | 1.485 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 17 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-163-1771 |
| INCLOSURE MATERIAL | CERAMIC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY LENGTH | 0.770 INCHES NOMINAL IN |
| BODY HEIGHT | 0.175 INCHES NOMINAL IN |
| FEATURES PROVIDED | BIPOLAR AND HIGH SPEED AND PROGRAMMABLE AND SCHOTTKY |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.270 INCHES NOMINAL IN |