ROM/PROM HEAD 041 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 041: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.605 INCHES NOMINAL IN, body_length: 1.405 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-185-1564, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 041

NSN: 5962-01-185-1564
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.605 INCHES NOMINAL IN
body_length	1.405 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	DUAL-IN-LINE
specification/standard_data	81349-MIL-M-38510/502 GOVERNMENT SPECIFICATION
design_function_and_quantity	1 ARRAY, LOGIC
time_rating_per_chacteristic	80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
NSN	5962-01-185-1564

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC

•

BODY WIDTH: 0.605 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/502 GOVERNMENT SPECIFICATION

•

BODY LENGTH: 1.405 INCHES NOMINAL IN

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	17 INPUT
INCLOSURE MATERIAL	CERAMIC
DESIGN FUNCTION AND QUANTITY	1 ARRAY, LOGIC
BODY WIDTH	0.605 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/502 GOVERNMENT SPECIFICATION
BODY LENGTH	1.405 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

SUBSTITUTES & CROSS-REFERENCES 5

5924268-002Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

M38510/50202BXXReference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/50202BXBReference document

Same NSN cross-reference

Reference document — Secondary reference

MIL-M-38510/502Reference document

Same NSN cross-reference

Reference document — Identification reference

M38510/50202BXASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 041?

ROM/PROM HEAD 041 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 041?

There are 5 known substitutes for ROM/PROM HEAD 041: 5924268-002, M38510/50202BXX, M38510/50202BXB and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 041?

ROM/PROM HEAD 041 is cataloged in the U.S. Government catalog under NSN 5962-01-185-1564. This indicates validated use in U.S. government and defense supply chains.

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