ROM/PROM HEAD 034 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ROM/PROM HEAD 034: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN, output_logic_form: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-043-1614, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM HEAD 034

NSN: 5962-01-043-1614
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
body_length	1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
output_logic_form	P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
NSN	5962-01-043-1614

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND EXPANDABLE AND W/DECODED OUTPUT AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND HIGH SPEED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND EXPANDABLE AND W/DECODED OUTPUT AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND HIGH SPEED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

MC1702A/BReference document

Same NSN cross-reference

Reference document — Secondary reference

AM9702AHDL-BReference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 84124BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ROM/PROM HEAD 034?

ROM/PROM HEAD 034 is a MICROCIRCUIT,DIGITAL.

What parts can replace ROM/PROM HEAD 034?

There are 3 known substitutes for ROM/PROM HEAD 034: MC1702A/B, AM9702AHDL-B, DMS 84124B. Substitute compatibility should be verified for your specific system.

What is the NSN for ROM/PROM HEAD 034?

ROM/PROM HEAD 034 is cataloged in the U.S. Government catalog under NSN 5962-01-043-1614. This indicates validated use in U.S. government and defense supply chains.

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