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Technical Data Sheet

ROM/PROM HEAD 006 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ROM/PROM HEAD 006: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-017-3504, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM HEAD 006
NSN: 5962-01-017-3504
FSC: 5962 — Microcircuits, Electronic
CAGE: 14933 — DEFENSE ELECTRONICS SUPPLY CENTER (USA)
SPECIFICATIONS
body_width0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN
body_length0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 STAGE
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-017-3504
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ROM/PROM HEAD 006 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 STAGE
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT AND W/ENABLE AND W/DISABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND WIRE-OR OUTPUTS
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 STAGE
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.260 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT AND W/ENABLE AND W/DISABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND WIRE-OR OUTPUTS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
725016A0045-001Reference document
Same NSN cross-reference
Reference document — Vendor item drawing reference
HRP0M1+1024+5Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM HEAD 006?
ROM/PROM HEAD 006 is a MICROCIRCUIT,MEMORY.
What parts can replace ROM/PROM HEAD 006?
There are 2 known substitutes for ROM/PROM HEAD 006: 725016A0045-001, HRP0M1+1024+5. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM HEAD 006?
ROM/PROM HEAD 006 is cataloged in the U.S. Government catalog under NSN 5962-01-017-3504. This indicates validated use in U.S. government and defense supply chains.
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