ROM/PROM FAMILY 206 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: PROGRAMMED, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-390-6600, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM FAMILY 206

NSN: 5962-01-390-6600
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

special_features	PROGRAMMED
features_provided	PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	CONTROL INDICATOR E/I FSCM 26512
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
maximum_power_dissipation_rating	1.2 WATTS
NSN	5962-01-390-6600

COMPONENT DIAGRAM

KEY FEATURES

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED

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MEMORY DEVICE TYPE: PAL

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CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

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MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
END ITEM IDENTIFICATION	CV-3993/SYS-2
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
MAXIMUM POWER DISSIPATION RATING	1.2 WATTS
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATION	DUAL-IN-LINE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 12

30094InterchangeableGOVERNMENT REGISTRY