ROM/PROM FAMILY 149 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.605 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.415 INCHES MAXIMUM IN, overall_height: 0.432 INCHES MAXIMUM IN, overall_length: 1.490 INCHES MAXIMUM IN, memory_capacity: 65536 BIT 8192 WORD. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-287-0711, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM FAMILY 149

NSN: 5962-01-287-0711
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.605 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.415 INCHES MAXIMUM IN
overall_height	0.432 INCHES MAXIMUM IN
overall_length	1.490 INCHES MAXIMUM IN
memory_capacity	65536 BIT 8192 WORD
special_features	PROGRAM TO CAGE 07187 TRUTH TABLE TT8513345-110
features_provided	HERMETICALLY SEALED AND BURN IN AND W/BUFFERED OUTPUT AND W/ENABLE AND HIGH SPEED AND ULTRAVIOLET ERASABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-287-0711

COMPONENT DIAGRAM

KEY FEATURES

•

BODY LENGTH: 1.490 INCHES MAXIMUM IN

•

MAXIMUM POWER DISSIPATION RATING: 170.0 MILLIWATTS

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

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FEATURES PROVIDED: PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND W/ENABLE AND ELECTROSTATIC SENSITIVE

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510

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TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

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TERMINAL SURFACE TREATMENT: SOLDER

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -2.0 VOLTS MINIMUM POWER SOURCE AND 14.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY LENGTH	1.490 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING	170.0 MILLIWATTS
INCLOSURE MATERIAL	CERAMIC AND GLASS
FEATURES PROVIDED	PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND W/ENABLE AND ELECTROSTATIC SENSITIVE
CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-2.0 VOLTS MINIMUM POWER SOURCE AND 14.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	ROM

VERIFIED SUBSTITUTES & CROSS-REFERENCES 15

10129525Interchangeable