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ROM/PROM FAMILY 136 — Technical Data Sheet

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— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, special_features: ALTERED ITEM DRAWING, features_provided: BIPOLAR AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-302-9135, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ROM/PROM FAMILY 136
NSN: 5962-01-302-9135
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
special_featuresALTERED ITEM DRAWING
features_providedBIPOLAR AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROGRAMMED
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-302-9135
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN ROM/PROM FAMILY 136 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
•
BODY LENGTH: 1.250 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
DESIGN FUNCTION AND QUANTITY1 ARRAY, LOGIC
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
MAXIMUM POWER DISSIPATION RATING1.2 WATTS
BODY LENGTH1.250 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 8
PAL20R4A-2MJS/883BInterchangeable
interchangeable cross-reference
interchangeable
8412912LXInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 136Interchangeable
interchangeable cross-reference
interchangeable
10134008Interchangeable
interchangeable cross-reference
interchangeable
8412912LAInterchangeable
interchangeable cross-reference
interchangeable
210716-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is ROM/PROM FAMILY 136?
ROM/PROM FAMILY 136 is a MICROCIRCUIT,DIGITAL.
What parts can replace ROM/PROM FAMILY 136?
There are 8 known substitutes for ROM/PROM FAMILY 136: PAL20R4A-2MJS/883B, 8412912LX, ROM/PROM HEAD 136 and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ROM/PROM FAMILY 136?
ROM/PROM FAMILY 136 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-302-9135. This indicates validated use in U.S. government and defense supply chains.
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Last verified: September 2026