ROM/PROM FAMILY 126 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.450 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-287-0075, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM FAMILY 126

NSN: 5962-01-287-0075
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.450 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.450 INCHES MAXIMUM IN
features_provided	PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-287-0075

COMPONENT DIAGRAM

KEY FEATURES

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INCLOSURE MATERIAL: CERAMIC

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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TERMINAL TYPE AND QUANTITY: 28 LEADLESS

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

CURRENT RATING PER CHARACTERISTIC: 120.00 MILLIAMPERES MAXIMUM SUPPLY

•

TERMINAL SURFACE TREATMENT: SOLDER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	28 LEADLESS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CURRENT RATING PER CHARACTERISTIC	120.00 MILLIAMPERES MAXIMUM SUPPLY
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	PROM
TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM DELAY NS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

312A3888P40Interchangeable