ROM/PROM FAMILY 087: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, overall_width: 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN, overall_height: 0.425 INCHES MAXIMUM IN, overall_length: 1.200 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-228-1855, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.250 INCHES MAXIMUM IN |
| overall_width | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN |
| overall_height | 0.425 INCHES MAXIMUM IN |
| overall_length | 1.200 INCHES MAXIMUM IN |
| features_provided | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-228-1855 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 ARRAY, LOGIC |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.205 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND HIGH RELIABILITY AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |