ROM/PROM 016 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.275 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.920 INCHES MINIMUM AND 1.070 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND LOW POWER AND MONOLITHIC AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-196-1446, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ROM/PROM 016

NSN: 5962-01-196-1446
FSC: 5962
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)

SPECIFICATIONS

body_width	0.275 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.920 INCHES MINIMUM AND 1.070 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	PROGRAMMABLE AND LOW POWER AND MONOLITHIC AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	4920-01-135-4606 TEST SET,COUNTE
NSN	5962-01-196-1446

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS

•

FEATURES PROVIDED: PROGRAMMABLE AND LOW POWER AND MONOLITHIC AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

TERMINAL SURFACE TREATMENT: SOLDER

•

MEMORY CAPACITY: UNKNOWN

•

TIME RATING PER CHACTERISTIC: 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MAXIMUM POWER DISSIPATION RATING	500.0 MILLIWATTS
FEATURES PROVIDED	PROGRAMMABLE AND LOW POWER AND MONOLITHIC AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY CAPACITY	UNKNOWN
TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE	ROM
INCLOSURE MATERIAL	PLASTIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 6

TBP28S42Interchangeable