RM7553: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MAXIMUM IN, body_height: 0.030 INCHES MAXIMUM IN, body_length: 0.265 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-993-0069, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MAXIMUM IN |
| body_length | 0.265 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PRESETTABLE AND RESETTABLE AND NEGATIVE EDGE TRIGGERED AND W/ENABLE AND ASYNCHRONOUS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| NSN | 5962-00-993-0069 |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP, J-K, AND INPUT AND 1 FLIP-FLOP, J-K/R-S, CLOCKED |
| BODY WIDTH | 0.265 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.030 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PRESETTABLE AND RESETTABLE AND NEGATIVE EDGE TRIGGERED AND W/ENABLE AND ASYNCHRONOUS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.265 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |