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Technical Data Sheet
RM113-096 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: CURRENT-MODE LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-009-9959, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
RM113-096
NSN: 5962-00-009-9959
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formCURRENT-MODE LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-00-009-9959
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN RM113-096 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
MEMORY DEVICE TYPE: ROM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN: 8 INPUT
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING: 450.0 MILLIWATTS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 25.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIAL: CERAMIC AND GLASS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEROM
BODY WIDTH0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN8 INPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING450.0 MILLIWATTS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC25.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
CASE OUTLINE SOURCE AND DESIGNATORT0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
VERIFIED SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROM FAMILY 054Interchangeable
Same NIIN cross-reference
interchangeable
HM1-013-096Interchangeable
Same NIIN cross-reference
interchangeable
80701-20Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is RM113-096?
RM113-096 is a MICROCIRCUIT,MEMORY.
What parts can replace RM113-096?
There are 3 known substitutes for RM113-096: ROM/PROM FAMILY 054, HM1-013-096, 80701-20. Substitute compatibility should be verified for your specific system.
What is the NSN for RM113-096?
RM113-096 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-009-9959. This indicates validated use in U.S. government and defense supply chains.
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