The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.120 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_height: 0.055 INCHES MAXIMUM IN, body_length: 0.285 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-928-7385, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.120 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| body_height | 0.055 INCHES MAXIMUM IN |
| body_length | 0.285 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| NSN | 5962-00-928-7385 |
| DESIGN FUNCTION AND QUANTITY | 1 EXPANDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.285 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.120 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |